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Thermal Conductivity
These laminates have an adjustable coefficient of thermal expansion that can be correlated with a range of semiconductor substrates and still maintain high thermal conductivity. In short, they make an excellent heat sink. Anything that produces significant heat can benefit from using a Cu-Mo-Cu heat spreader. It takes highly localized heat sources and spreads the energy out through the layers.
If temperatures rise past the melting point of copper (1982°F), then the copper can liquify and act as a cooling agent for the molybdenum core. This is a great quality to possess when plating electronics and electrical components, as it prevents overheating during the transfer of electrical signals.
Strong Bonds
Due to their roll-bonding process, Cu-Mo-Cu laminates are tightly bonded. These tight bonds help increase the thermal resistance of the composites and the components they are protecting. These laminates can repeatedly reach levels of up to 1560°F (850°C) without consequence, making them an ideal pairing for microwave components or other parts that may be subject to constant and/or extreme temperatures.
Adjustable Coefficients
Since the two metals have opposite thermal expansion coefficients (Copper has a High thermal expansion coefficient, Molybdenum low), this allows us to alter the coefficient of the alloy so that it matches the thermal coefficient of the other materials that it is being paired with. This prevents a great deal of stress damage that can occur when mismatching thermal coefficients.
When plating for any kind of electronics, it is important to match the thermal expansion with a given die. Thermal mismatch can create an incompatibility between the die and the heat spreader that should be avoided. Fortunately, the thermal expansion can be matched by varying the ratio of the molybdenum with the copper.
Electrical Conductivity
They are also subject to low electrical resistance, and in turn, high electrical conductance. This makes them suitable for silicon-based devices as well as area power devices. Copper provides a great deal of conductivity and low electrical resistance, and a very low coefficient of thermal expansion provided by the inner layer of molybdenum.
High Practicality and Machinability
In its purest form, Molybdenum has a high hardness level and is very brittle. These physical properties make it difficult to machine. Copper on the other hand, is much more malleable. The combination of the two causes the flexibility of the alloy to increase greatly, making it useful for machining or other parts that are subject to heavy use and/or wear.
Non-Magnetic
Finally, Cu-Mo-Cu laminates are non-magnetic. This makes these parts incredibly useful when working with products that may contain small magnetic components that would otherwise be affected by a magnetic charge. The lack of magnetism makes these Copper Molybdenum composites a common pairing in a variety of intricate electronics.
